Multilayer Immersion Gold Electronics Mobile Phone Circuit Board PCB

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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  • Multilayer Immersion Gold Electronics Mobile Phone Circuit Board PCB
  • Multilayer Immersion Gold Electronics Mobile Phone Circuit Board PCB
  • Multilayer Immersion Gold Electronics Mobile Phone Circuit Board PCB
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Basic Info.

Model NO.
pcb1109
Material
Fiberglass Epoxy
Application
Communication
Flame Retardant Properties
V1
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Metal Composite Materials
Brand
OEM/ODM PCB
MOQ
1 PCS
Certificate
ISO9001 2015, TUV Sud
Min Hole Size
0.1mm (4 Mil)
Copper Thickness
0.5 Oz-3oz (18 Um-385 Um)
Board Thickness
0.2mm-4mm
Surface Finish
HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc
Service
PCB/PCBA/PCB Design and Layout
Test Service
E-Test, Aoi, X-ray, Function Test
Specialised
Medical, Industrial, Control Board,Ce
Delivery
PCB Board, 3-5 Days;PCBA, 2-3weeks
Product Name
Electronics Mobile Phone Circuit Board PCB
Transport Package
Vacuum Packing/Blister/Plastic /Cartoon
Specification
CE, RohS, UL, SGS, ISO9001, 94v0
Trademark
Mobile Phone Circuit Board PCB
Origin
Shenzhen, Guangdong
HS Code
8534009000
Production Capacity
500000000PCS/Year

Product Description

Multilayer Immersion Gold Electronics Mobile Phone Circuit Board PCBMultilayer Immersion Gold Electronics Mobile Phone Circuit Board PCB

                                                       WHY CHOOSE STHL Multilayer Immersion Gold Electronics Mobile Phone Circuit Board PCB
                                                           
                                                    COMPANY PROFILES
Multilayer Immersion Gold Electronics Mobile Phone Circuit Board PCB

 Products Capability

Items PCB capacity
 Product name  Multilayer Immersion Gold electronics mobile phone circuit board pcb 
 Material  FR-4; High TG FR-4; Aluminum; CEM-1; CEM-3;  Rogers, etc
 PCB type  Rigid, flexible, rigid-flexible
 Layer NO.  1, 2, 4, 6, up to 24 layer
 Shape  Rectangular, round, slots, cutouts, complex, irregular
 Max PCB dimensions  1200mm*600mm
 Board Thickness  0.2mm-4mm
 Thickness Tolerance  ±10%
 Min Hole Size  0.1mm (4 mil)
 Copper Thickness  0.5 OZ-3OZ (18 um-385 um)
 Copper Plating hole  18um-30um
 Min Trace Width  0.075mm (3mil)
 Min Space Width   0.1mm (4 mil)
 Surface finish  HASL, LF HASL, Imm Gold, Imm Silver, OSP etc
 Solder mask   Green, red, white, yellow, blue, black, orange, purp
 
Items PCBA capacity
 Product name  Multilayer Immersion Gold electronics mobile phone circuit board pcb
 Assembly details  SMT and Thru-hole, ISO SMT and DIP lines
 Testing on products  Testing jig/mold , X-ray Inspection, AOI Test, Functional test
 Quantity  Min quantity : 1pcs. Prototype, small order, mass order, all OK
 Files needed  PCB : Gerber files(CAM, PCB, PCBDOC)
 Components : Bill of Materials(BOM list)
 Assembly : Pick-N-Place file
 PCB Panel Size  Min size : 0.25*0.25 inches(6*6mm)
 Max size : 1200*600mm
 Components details  Passive Down to 0201 size
 BGA and VFBGA
 Leadless Chip Carriers/CSP
 Double-sided SMT Assembly
 Fine BGA Pitch to 0.2mm(8mil)
 BGA Repair and Reball
 Part Removal and Replacement
 Component package Cut Tape, Tube, Reels, Loose Parts
 PCB+ assembly process Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity


 PCB Showcase
Multilayer Immersion Gold Electronics Mobile Phone Circuit Board PCB

 PCBA Showcase
Multilayer Immersion Gold Electronics Mobile Phone Circuit Board PCB  
 Dust-free workshop with 6 SMT lines, 2 THT lines and 2 finished products assembly lines

Multilayer Immersion Gold Electronics Mobile Phone Circuit Board PCB
 Quality department

Multilayer Immersion Gold Electronics Mobile Phone Circuit Board PCB

Testing and maintenance department
Multilayer Immersion Gold Electronics Mobile Phone Circuit Board PCB
 Warehouse department
Multilayer Immersion Gold Electronics Mobile Phone Circuit Board PCB
Equipments showcase

Multilayer Immersion Gold Electronics Mobile Phone Circuit Board PCB
                                                                   
                                                                   CERTIFICATION
Multilayer Immersion Gold Electronics Mobile Phone Circuit Board PCB

                                                           PACKING AND SHIPPING
Multilayer Immersion Gold Electronics Mobile Phone Circuit Board PCB

 

FAQ

Q1.What is needed for quotation?

A: PCB : Quantity, Gerber file and Technic requirements(material,surface finish treatment, copper thickness,board thickness ,...)
PCBA: PCB information, BOM, (Testing documents...)

Q2. What file formats do you accept for production?
A: Gerber file: CAM350 RS274X
PCB file: Protel 99SE, P-CAD 2001 PCB
BOM: Excel (PDF,word,txt)

Q3. Are my files safe?
A: Your files are held in complete safety and security.We protect the intellectual property for our customers in the whole process.. All documents from customers are never shared with any third parties.

Q4. MOQ?
A: There is no MOQ in STHL.We are able to handle Small as well as large volume production with flexibility.

Q5.Shipping cost?
A: The shipping cost is determined by the destination, weight, packing size of the goods. Please let us know if you need us to quote you the shipping cost.

Q6. Do you accept process materials supplied by clients?

A Yes, we can provide component source, and we also accept component from client
    

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